With better transmission quality and higher transmission speed, the maximum concurrent speed of the whole machine can reach 3000Mbps.

Using Qualcomm chips, it supports 160MHz, greatly expanding user capacity and supporting over 120 users.

The heat sink adopts a buckle structure design and a special surface coating treatment, resulting in a more ideal heat dissipation effect.

The RF adopts high-power external FEM, which has stable performance, wide wireless range, and longer transmission distance.